Browsing by author "Kay, Alvin Chow Chee"

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Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability

Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric (2015)