Publication:

Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability

Date

2015

Proceedings Paper

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Author(s)

;

De Messemaeker, Joke

;

Cherman, Vladimir

;

Kay, Alvin Chow Chee

;

Cadacio Jr., Francisco

;

Matterne, Mireille

;

;

Van De Peer, Myriam

;

Lesniewska, Alicja

;

Varela Pedreira, Olalla

;

;

Rebibis, Kenneth June

;

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1966 since deposited on 2021-10-23

Acq. date: 2026-04-08