Authors

Wang, Teng; De Messemaeker, Joke; Cherman, Vladimir; Kay, Alvin Chow Chee; Cadacio Jr., Francisco; Matterne, Mireille; Simons, Veerle; Van De Peer, Myriam; Lesniewska, Alicja; Varela Pedreira, Olalla; Gerets, Carine; Rebibis, Kenneth June; Beyne, Eric

Conference

Electronic Packaging Technology Conference - EPTC

Title

Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability

Publication type

Proceedings paper