Browsing by author "Coenen, Jens"
Now showing items 1-3 of 3
-
3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009) -
Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Huyghebaert, Cedric; Van Olmen, Jan; Okoro, Chukwudi; Coenen, Jens; Jourdain, Anne; Van Cauwenberghe, Marc; Agarwal, Rahul; Phommahaxay, Alain; Stucchi, Michele; Soussan, Philippe (2010) -
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef (2010)