Authors

Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef

Conference

Materials for Advanced Metallization - MAM

Title

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

Publication type

Meeting abstract

Embargo date

9999-12-31