Publication:

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

Date

2010
Meeting abstract
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dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorCoenen, Jens
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorSleeckx, Erik
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorArmini, Silvia
dc.contributor.authorVaes, Jan
dc.contributor.authorBeyne, Eric
dc.contributor.authorTravaly, Youssef
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T23:12:24Z
dc.date.available2021-10-18T23:12:24Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18198
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate7/03/2010
dc.source.conferencelocationMechelen Belgium
dc.title

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

dc.typeMeeting abstract
dspace.entity.typePublication
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