Browsing by author "Arumugam, Hariharan"
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Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019)