Browsing by author "Harkness, Brian"
Now showing items 1-4 of 4
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Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Gonzalez, Mario; Vanden Bulcke, Mathieu; Vandevelde, Bart; Beyne, Eric; Lee, Yeong; Harkness, Brian; Meynen, Herman (2004) -
Patternable silicones for next generation packaging reliability requirements
Kunselman, Michael; Larson, Lyndon; Harkness, Brian; Gardner, Geoff; Alger, James; Cummings, Michelle; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Study of the integration of a new elastomeric material in a silicone under the bump configuration
Vanden Bulcke, Mathieu; Gonzalez, Mario; Winters, Christophe; Beyne, Eric; Meynen, Herman; Gardner, Geoff; Harkness, Brian (2004) -
Ultra low stress and low temperature patternable silicone materials for applications within microelectronics
Meynen, Herman; Vanden Bulcke, Mathieu; Gonzalez, Mario; Harkness, Brian; Gardner, Geoff; Sudbury-Holtschlag, Joan; Vandevelde, Bart; Winters, Christophe; Beyne, Eric (2004)