Browsing by author "Kögel, Michael"
Now showing items 1-3 of 3
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Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatiana; Ingo, Wiesler (2018-11) -
GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
De Wolf, Ingrid; Khaled, Ahmad; Franquet, Alexis; Spampinato, Valentina; Conard, Thierry; Brand, Sebastian; Kögel, Michael; Wiesler, Ingo (2019) -
Study of GHz-SAM sensitivity to delamination in BEOL layers
Khaled, Ahmad; Kljucar, Luka; Brand, Sebastian; Kögel, Michael; Aertgeerts, R.; Nicasy, R.; De Wolf, Ingrid (2017)