Browsing by author "Naito, Yasyuki"
Now showing items 1-1 of 1
-
A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
Bogaerts, Lieve; Phommahaxay, Alain; Rottenberg, Xavier; Naito, Yasyuki; De Coster, Jeroen; Varela Pedreira, Olalla; Van Hoovels, Nele; Cherman, Vladimir; Helin, Philippe; Onishi, K.; Tilmans, Harrie (2011)