Browsing by author "Chery, Emmanuel"
Now showing items 1-17 of 17
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Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers
Chery, Emmanuel; Slabbekoorn, John; Pinho, Nelson; Miller, Andy; Beyne, Eric (2021) -
Assessment of critical Co electromigration parameters
Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Roussel, Philippe; van der Veen, Marleen; Simons, Veerle; Chery, Emmanuel; Ciofi, Ivan; Croes, Kristof (2022) -
Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer
Pantano, Nicolas; Chery, Emmanuel; Op de Beeck, Maaike; Slabbekoorn, John; Beyne, Eric (2022) -
Characterization and Reliability Study of an Al-Doped HfO2-Based High-Density 2.5-D MIMCAP
Chery, Emmanuel; Croes, Kristof; Nolmans, Philip; Beyne, Eric (2024) -
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne; Schleicher, Filip; De Vos, Joeri; Stucchi, Michele; Chery, Emmanuel; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Walsby, Edward; Roberts, Kerry; Ashraf, Huma; Thomas, Dave; Beyne, Eric (2020) -
Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability
Pinho, Nelson; Chery, Emmanuel; Bhatia, Ritwik; Sundaram, Ganesh; Slabbekoorn, John; Krishtab, Mikhail; Miller, Andy; Beyne, Eric (2023) -
Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability
Chery, Emmanuel; Brady-Boyd, Anita; Bhatia, Ritwik; Pinho, Nelson; Slabbekoorn, John; Armini, Silvia; Sundaram, Ganesh; Beyne, Eric (2023) -
Investigating the Efficacy of Hafnium Dioxide Barrier Layers to Halt Copper Oxide Formation in Redistribution Layers for Three-Dimensional (3D) Packaging
Brady-Boyd, Anita; Chery, Emmanuel; Armini, Silvia (2022) -
Low-Temperature Oxidation Kinetics of Polymer-Embedded ECD Copper
Chery, Emmanuel; Croes, Kristof (2023-06) -
Photosensitive polymer reliability for fine pitch RDL applications
Chery, Emmanuel; Duval, Fabrice; Stucchi, Michele; Slabbekoorn, John; Croes, Kristof; Beyne, Eric (2020-06) -
Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies
Chery, Emmanuel; Fohn, Corinna; De Messemaeker, Joke; Beyne, Eric (2023) -
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Hou, Lin; Chery, Emmanuel; Croes, Kristof; Tierno, Davide; Chew, Soon Aik; Chen, Yangyin; Rakbin, Peter; Beyne, Eric (2022-03) -
Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
Kwak, Ji-Youn; Chery, Emmanuel; Bertheau, Julien; Slabbekoorn, John; De Messemaeker, Joke; Beyne, Eric (2023) -
Reliability Study of Polymers Used in Sub-4-mu m Pitch RDL Applications
Chery, Emmanuel; Duval, Fabrice; Stucchi, Michele; Slabbekoorn, John; Croes, Kristof; Beyne, Eric (2021) -
Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing
Pinho, Nelson; Chery, Emmanuel; Pantano, Nicolas; Slabbekoorn, John; Miller, Andy; Beyne, Eric (2023) -
Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies
Chery, Emmanuel; Brady-Boyd, Anita; Lin, Yuyuan; Grimes, Michael; Springer, David; Slabbekoorn, John; Walsby, Edward; Croes, Kristof; Beyne, Eric (2022-10-15) -
Voltage ramp stress based lifetime-prediction model of advanced Al-doped HfO2 dielectric for 2.5D MIMCAPs
Fohn, Corinna; Chery, Emmanuel; Croes, Kristof; Stucchi, Michele; Afanasiev, Valeri (2024)