Browsing by author "Yu, Doug C.H."

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Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond

Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014)