Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond

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Authors
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H.
Conference
IEEE 64th Electronic Components and Technology Conference - ECTC
Title
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Publication type
Proceedings paper
Embargo date
9999-12-31
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