Publication:

Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond

Date

2014
Proceedings Paper
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dc.contributor.authorHu, Yu-Hsiang
dc.contributor.authorLiu, C.S.
dc.contributor.authorChen, M.T.
dc.contributor.authorCheng, M.D.
dc.contributor.authorKuo, H.J.
dc.contributor.authorLii, M.J.
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorYu, Doug C.H.
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T02:07:59Z
dc.date.available2021-10-22T02:07:59Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23966
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897342&contentType=Conference+Publications
dc.source.beginpage572
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage575
dc.title

Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond

dc.typeProceedings paper
dspace.entity.typePublication
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