Browsing by author "Sawano, Mitsuru"

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A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017)
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, Mitsuru; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2015)