Browsing by author "Andersson, Dag"
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Package and solder joint reliability analysed by FEM simulation and experiments
Vandevelde, Bart; Andersson, Dag (2004-12) -
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
Andersson, Cristina; Vandevelde, Bart; Noritake, Chikage; Sun, P; Tegehall, Per-Erik; Andersson, Dag; Wetter, G; Liu, Johan (2009)