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Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
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Authors
Andersson, Cristina
;
Vandevelde, Bart
;
Noritake, Chikage
;
Sun, P
;
Tegehall, Per-Erik
;
Andersson, Dag
;
Wetter, G
;
Liu, Johan
ISSN
0954-0911
Issue
2
Journal
Soldering & Surface Mount Technology
Volume
21
Title
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
Publication type
Journal article
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