Browsing by author "Oppermann, H."

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3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Sirbu, B.; Eichhammer, Y.; Oppermann, H.; Tekin, T.; Kraft, J.; Sidorov, V.; Yin, Xin; Bauwelinck, Johan; Neumeyr, C.; Soares, F. (2019)