Browsing by author "Baelmans, Martine"
Now showing items 1-20 of 29
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3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Baelmans, Martine (2018) -
3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
Maggioni, Federica; Oprins, Herman; Milojevic, Dragomir; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2015) -
A modeling and experimental method for accurate thermal analysis of AlGan/GaN HEMT power-bars
Sodan, Vice; Stoffels, Steve; Oprins, Herman; Baelmans, Martine; Decoutere, Stefaan; De Wolf, Ingrid (2015) -
Advancements in thermal-fluid engineering and its application to electronics cooling system design
Baelmans, Martine; Buckinx, Geert; Gielen, Ruben; Maggioni, Federica; Saenen, Tom; Van Oevelen, Tijs (2014) -
Conjugate heat transfer and fluid flow model for microjet cooling with alternating feeding and draining channels
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric; Baelmans, Martine (2019) -
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Oprins, Herman; Danneels, Johan; Van Ham, Brecht; Vandevelde, Bart; Baelmans, Martine (2008-07) -
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Oprins, Herman; Danneels, Johan; Van Ham, Brecht; Vandevelde, Bart; Baelmans, Martine (2007-01) -
Convolution-based fast thermal model for 3D-ICs: transient experimental validation
Maggioni, Federica; Cherman, Vladimir; Oprins, Herman; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2017) -
Cooling of microelectronics using electrostatic actuated liquid droplets
Oprins, Herman; Vandevelde, Bart; Baelmans, Martine (2007) -
Digital and continuous liquid cooling for electronic systems
Baelmans, Martine; Oprins, Herman; Stevens, Tine; Rogiers, Frederik (2007-04) -
Distributed electro-thermal model based on fast and scalable algorithm for GaN power devices and circuit simulations
Sodan, Vice; Oprins, Herman; Stoffels, Steve; Baelmans, Martine; Decoutere, Stefaan; De Wolf, Ingrid (2017-05) -
Experimental and numerical investigation of the direct jet impinging cooling on lidded or lidless package for 2.5D integrated systems using 3D printing technology
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric; Baelmans, Martine (2020) -
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Zhi; Rivera, Kathryn C.; Van der Plas, Geert; England, Luke; Baelmans, Martine; Pawlak, Bartek; Beyne, Eric (2021) -
Experimental benchmarking of electrical methods and $l-Raman spectroscopy for channel temperature detection in AlGaN/GaN HEMTs
Sodan, Vice; Kosemura, Daisuke; Stoffels, Steve; Oprins, Herman; Baelmans, Martine; Decoutere, Stefaan; De Wolf, Ingrid (2016) -
Fast and distributed thermal model for thermal modeling of GaN power devices
Sodan, Vice; Stoffels, Steve; Oprins, Herman; Decoutere, Stefaan; Altmann, Frank; Baelmans, Martine; De Wolf, Ingrid (2018-10) -
Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact
Maggioni, Federica; Oprins, Herman; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2014-12) -
Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs
Maggioni, Federica; Oprins, Herman; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2016) -
First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Wei, Tiwei; Oprins, Herman; Beyne, Eric; Cherman, Vladimir; De Wolf, Ingrid; Baelmans, Martine (2019-05) -
Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets
Fang, Liang; Baelmans, Martine; Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric (2022-01) -
High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Baelmans, Martine (2017)