Authors

Maggioni, Federica; Oprins, Herman; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine

ISSN

2156-3950

Issue

3

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

6

Title

Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs

Publication type

Journal article

Embargo date

9999-12-31