Browsing by author "Zanon, Franco"
Now showing items 1-5 of 5
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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Vandevelde, Bart; Zanon, Franco; Griffoni, Alessio; Li, Xiaoling; Willems, Geert; Meneghini, Matteo (2015) -
Improved and accurate physics-of-failure (PoF) nethodology for qualification and lifetime assessment of electronic systems
Temsamani, A.B.; Kauffmann, S.; Descas, Y.; Vandevelde, Bart; Zanon, Franco; Willems, Geert (2017) -
Methodology for solder-joint lifetime prediction of LED-based PCB assemblies
Vandevelde, Bart; Griffoni, Alessio; Zanon, Franco; Willems, Geert (2018) -
Physics of failure based quantification of life time for electronics board assemblies
Vandevelde, Bart; Labie, Riet; Zanon, Franco; Willems, Geert (2017-06)