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Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Publication:
Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Date
2015
Proceedings Paper
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31847.pdf
1.99 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Zanon, Franco
;
Griffoni, Alessio
;
Li, Xiaoling
;
Willems, Geert
;
Meneghini, Matteo
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Abstract
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1869
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations
Metrics
Views
1869
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations