Publication:

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Date

2015
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorZanon, Franco
dc.contributor.authorGriffoni, Alessio
dc.contributor.authorLi, Xiaoling
dc.contributor.authorWillems, Geert
dc.contributor.authorMeneghini, Matteo
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-23T00:23:13Z
dc.date.available2021-10-23T00:23:13Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26101
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103170
dc.source.beginpage1
dc.source.conference16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate20/04/2015
dc.source.conferencelocationBudapest Hungary
dc.source.endpage4
dc.title

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

dc.typeProceedings paper
dspace.entity.typePublication
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