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Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Publication:
Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
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Date
2015
Proceedings Paper
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31847.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Zanon, Franco
;
Griffoni, Alessio
;
Li, Xiaoling
;
Willems, Geert
;
Meneghini, Matteo
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1872
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Acq. date: 2025-12-14
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Views
1872
since deposited on 2021-10-23
1
last month
Acq. date: 2025-12-14
Citations