Browsing by author "Ding, Youqi"
Now showing items 1-3 of 3
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A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Ding, Youqi; Lofrano, Melina; Varela Pedreira, Olalla; Zahedmanesh, Houman; Croes, Kristof; De Wolf, Ingrid (2022) -
Challenges for Interconnect Reliability: From Element to System Level
Varela Pedreira, Olalla; Zahedmanesh, Houman; Ding, Youqi; Ciofi, Ivan; Croes, Kristof (2023) -
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters
Ding, Youqi; Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Chavez, T.; Farr, H.; De Wolf, Ingrid; Croes, Kristof (2023)