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A combined modelling approach to design test structures to study thermomigration in Cu interconnects
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Authors
Ding, Youqi
;
Lofrano, Melina
;
Varela Pedreira, Olalla
;
Zahedmanesh, Houman
;
Croes, Kristof
;
De Wolf, Ingrid
DOI
10.1016/j.microrel.2022.114632
ISSN
0026-2714
Issue
na
Journal
MICROELECTRONICS RELIABILITY
Volume
138
Title
A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Publication type
Journal article
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2
20.500.12860/40920.2
*
2023-03-02T13:37:47Z
validation by library/open access desk
1
20.500.12860/40920
2022-12-30T03:10:10Z
*Selected version
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