Browsing by author "Lofrano, Melina"
Now showing items 1-20 of 64
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3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
Lofrano, Melina; Wilson, Chris; Croes, Kristof (2012) -
A CMOS-compatible 20MHz poly-SiGe MEMS oscillator with low-power heating for frequency stabilization over temperature
Jansen, Roelof; Libois, Michael; Rottenberg, Xavier; Lofrano, Melina; De Coster, Jeroen; Van Hoof, Rita; Severi, Simone; Van der Plas, Geert; De Raedt, Walter; Tilmans, Harrie; Donnay, Stephane; Borremans, Jonathan (2011) -
A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Ding, Youqi; Lofrano, Melina; Varela Pedreira, Olalla; Zahedmanesh, Houman; Croes, Kristof; De Wolf, Ingrid (2022) -
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Lofrano, Melina; Gonzalez, Mario; Vandevelde, Bart (2014) -
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Lofrano, Melina; Gonzalez, Mario; Vandevelde, Bart; Tokei, Zsolt (2013) -
A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020) -
A novel test method for simultaneous measurement of thermal conductivity, CTE, residual stress and Young's modulus of suspended thin films using a laser Doppler vibrometer
De Coster, Jeroen; Lofrano, Melina; Jansen, Roelof; Rottenberg, Xavier; Severi, Simone; Borremans, Jonathan; Van der Plas, Geert; Donnay, Stephane; Tilmans, Harrie; De Wolf, Ingrid (2011) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly
Lofrano, Melina; Cherman, Vladimir; Gonzalez, Mario; Beyne, Eric (2017) -
An investigation of thermo-mechanical stress in IC's induced during chip assembly
Lofrano, Melina; Gonzalez, Mario; Cherman, Vladimir; Beyne, Eric (2018) -
Assessment of critical Co electromigration parameters
Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Roussel, Philippe; van der Veen, Marleen; Simons, Veerle; Chery, Emmanuel; Ciofi, Ivan; Croes, Kristof (2022) -
Bump pad design and its impact on the reliability of flip chip packages
Gonzalez, Mario; Lofrano, Melina; Vanstreels, Kris; Zahedmanesh, Houman; Beyne, Eric (2018) -
Calibrated fast thermal calculation and experimental characterization of advanced BEOL stacks
Chang, Xinyue; Oprins, Herman; Lofrano, Melina; Cherman, Vladimir; Vermeersch, Bjorn; Diaz Fortuny, Javier; Park, Seongho; Tokei, Zsolt; De Wolf, Ingrid (2023) -
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012) -
Chip package interaction: A stress analysis on 3D IC's packages
Lofrano, Melina; Gonzalez, Mario; Guo, Wei; Van der Plas, Geert (2015) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014)