Publication:
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Date
Loading...
Files
Journal
Abstract
Description
Metrics
Views
1968 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-16
Citations
Metrics
Views
1968 since deposited on 2021-10-21
1last month
Acq. date: 2025-12-16
Citations