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A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

Date

2013
Meeting abstract
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dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-21T09:31:45Z
dc.date.available2021-10-21T09:31:45Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22718
dc.source.conferenceMaterials for Advances Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
dc.title

A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

dc.typeMeeting abstract
dspace.entity.typePublication
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