Chip-package interaction in 3D stacked IC packages using finite element modelling

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Authors
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt
ISSN
0026-2714
Issue
6_7
Journal
Microelectronics Reliability
Volume
54
Title
Chip-package interaction in 3D stacked IC packages using finite element modelling
Publication type
Journal article
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