Publication:

Chip-package interaction in 3D stacked IC packages using finite element modelling

Date

2014

Journal article

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Author(s)

Vandevelde, Bart

;

Ivankovic, Andrej

;

Debecker, Bjorn

;

Lofrano, Melina

;

Vanstreels, Kris

;

;

Cherman, Vladimir

;

Gonzalez, Mario

;

Van der Plas, Geert

;

De Wolf, Ingrid

;

;

Journal

Microelectronics Reliability

Metrics

1933 since deposited on 2021-10-22

Acq. date: 2026-01-07