Publication:

Chip-package interaction in 3D stacked IC packages using finite element modelling

Date

2014
Journal article
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGuo, Wei
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T07:29:45Z
dc.date.available2021-10-22T07:29:45Z
dc.date.issued2014
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24729
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271414000833
dc.source.beginpage1200
dc.source.endpage1205
dc.source.issue6_7
dc.source.journalMicroelectronics Reliability
dc.source.volume54
dc.title

Chip-package interaction in 3D stacked IC packages using finite element modelling

dc.typeJournal article
dspace.entity.typePublication
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