Browsing by author "Lofrano, Melina"
Now showing items 21-40 of 64
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Degradation and failure analysis of copper and tungsten contacts under high fluence stress
Kauerauf, Thomas; Butera, Geni; Croes, Kristof; Demuynck, Steven; Wilson, Chris; Roussel, Philippe; Drijbooms, Chris; Bender, Hugo; Lofrano, Melina; Vandevelde, Bart; Tokei, Zsolt; Groeseneken, Guido (2010) -
Effects of packaging on mechanical stress in 3D-ICs
Cherman, Vladimir; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Van der Plas, Geert; De Vos, Joeri; Wang, Teng; Daily, Robert; Salahouelhadj, Abdellah; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2015) -
Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
Croes, Kristof; Wilson, Chris; Lofrano, Melina; Vereecke, Bart; Beyer, Gerald; Tokei, Zsolt (2010) -
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
Lofrano, Melina; Cherman, Vladimir; Gonzalez, Mario; Beyne, Eric (2018) -
Evaluation of mechanical stress induced during IC packaging
Cherman, Vladimir; Lofrano, Melina; Gonzalez, Mario; Cadacio Jr., Francisco; Rebibis, Kenneth June; Beyne, Eric; Takano, Akihito; Higashi, Mitsutoshi (2018) -
Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers
Zhao, Larry; Lofrano, Melina; Croes, Kristof; Van Besien, Els; Tokei, Zsolt; Wilson, Chris; Degraeve, Robin; Kauerauf, Thomas; Beyer, Gerald; Claeys, Cor (2011) -
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Inoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric (2021) -
Green mold compounds: impact on second level interconnect reliability
Vandevelde, Bart; Lofrano, Melina; Willems, Geert (2011-12) -
High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package
Cherman, Vladimir; Lofrano, Melina; Gonzalez, Mario; Van der Plas, Geert; Rebibis, Kenneth June; Beyne, Eric (2019) -
IC-package interaction
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Identification of key factors to reduce stress induced during 3D IC's assembly
Lofrano, Melina; Gonzalez, Mario; Cherman, Vladimir (2016) -
Impact of FEOL cross heating on the thermal performance of advanced BEOL
Lofrano, Melina; Vermeersch, Bjorn; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2022) -
Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding
Duval, Fabrice; Wang, Teng; Bex, Pieter; Lofrano, Melina; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric; Gerets, Carine (2017) -
Influence of test structure design on stress-induced-voiding using an experimentally validated finite element modeling approach
Lofrano, Melina; Croes, Kristof; De Wolf, Ingrid; Wilson, Chris (2011) -
Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
Kirimura, Tomoyuki; Croes, Kristof; Li, Yunlong; Demuynck, Steven; Wilson, Chris; Lofrano, Melina; Tokei, Zsolt (2012-04) -
Interconnect reliability – A study of the effect of dimensional and porosity scaling
Croes, Kristof; Wilson, Chris; Lofrano, Melina; Beyer, Gerald; Tokei, Zsolt (2011) -
Interpretation of Cu/SOG stress induced voiding using stress measurements performed with synchrotron radiation
Wilson, Chris; Croes, Kristof; Ablett, James; Lofrano, Melina; Beyer, Gerald; Tokei, Zsolt (2011) -
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
Croes, Kristof; Li, Yunlong; Lofrano, Melina; Wilson, Chris; Tokei, Zsolt (2013) -
Joule heating investigation for advanced interconnect schemes with airgaps
Lofrano, Melina; Varela Pedreira, Olalla; Ciofi, Ivan; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2021) -
Joule heating study in scaled Cu, Co and Ru interconnects
Lofrano, Melina; Varela Pedreira, Olalla; Croes, Kristof; Tokei, Zsolt (2019)