Publication:
Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
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1863 since deposited on 2021-10-18
3last month
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Acq. date: 2026-08-07
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Statistics
Views
1863 since deposited on 2021-10-18
3last month
1last week
Acq. date: 2026-08-07
Citations