Authors

Croes, Kristof; Wilson, Chris; Lofrano, Melina; Vereecke, Bart; Beyer, Gerald; Tokei, Zsolt

Conference

48th Annual IEEE International Reliability Physics Symposium - IRPS

Title

Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients

Publication type

Proceedings paper