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Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients
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1859 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
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Views
1859 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
Citations