Publication:

Evaluation of mechanical stress induced during IC packaging

Date

2018
Proceedings Paper
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Author(s)

Cherman, Vladimir  
;
Lofrano, Melina  
;
Gonzalez, Mario  
;
Cadacio Jr., Francisco
;
Rebibis, Kenneth June  
;
Beyne, Eric  
;
Takano, Akihito
;
Higashi, Mitsutoshi

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1940 since deposited on 2021-10-25
Acq. date: 2025-10-28

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1940 since deposited on 2021-10-25
Acq. date: 2025-10-28

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