Publication:

Evaluation of mechanical stress induced during IC packaging

Date

2018

Proceedings Paper

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Author(s)

Cherman, Vladimir

;

Lofrano, Melina

;

Gonzalez, Mario

;

Cadacio Jr., Francisco

;

Rebibis, Kenneth June

;

;

Takano, Akihito

;

Higashi, Mitsutoshi

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1943 since deposited on 2021-10-25

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Acq. date: 2026-04-05