Publication:

Evaluation of mechanical stress induced during IC packaging

Date

2018
Proceedings Paper
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dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.contributor.authorTakano, Akihito
dc.contributor.authorHigashi, Mitsutoshi
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T17:12:57Z
dc.date.available2021-10-25T17:12:57Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30408
dc.source.beginpage2162
dc.source.conferenceElectronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage2167
dc.title

Evaluation of mechanical stress induced during IC packaging

dc.typeProceedings paper
dspace.entity.typePublication
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