Publication:

Identification of key factors to reduce stress induced during 3D IC's assembly

Date

2016

Proceedings Paper

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Files

33608.pdf 985.44 KB

Author(s)

Lofrano, Melina

;

Gonzalez, Mario

;

Cherman, Vladimir

Statistics

1891 since deposited on 2021-10-23

Acq. date: 2026-02-26