Publication:

Effects of packaging on mechanical stress in 3D-ICs

Date

2015
Proceedings Paper
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Author(s)

Cherman, Vladimir  
;
Lofrano, Melina  
;
Simons, Veerle  
;
Gonzalez, Mario  
;
Van der Plas, Geert  
;
De Vos, Joeri  
;
Wang, Teng
;
Daily, Robert
;
Salahouelhadj, Abdellah  
;
Beyer, Gerald  
;
La Manna, Antonio  
;
De Wolf, Ingrid  
;
Beyne, Eric  

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Abstract

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