Publication:

Effects of packaging on mechanical stress in 3D-ICs

Date

2015
Proceedings Paper
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dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorSimons, Veerle
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorWang, Teng
dc.contributor.authorDaily, Robert
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorBeyer, Gerald
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T18:41:13Z
dc.date.available2021-10-22T18:41:13Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25073
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159617
dc.source.beginpage354
dc.source.conferenceIEEE 65th Electronic Components & Technology Conference - ECTC
dc.source.conferencedate26/05/2015
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage361
dc.title

Effects of packaging on mechanical stress in 3D-ICs

dc.typeProceedings paper
dspace.entity.typePublication
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