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Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
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Authors
Inoue, Fumihiro
;
Derakhshandeh, Jaber
;
Lofrano, Melina
;
Beyne, Eric
DOI
10.35848/1347-4065/abd69c
ISSN
0021-4922
Issue
2
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume
60
Title
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Publication type
Journal article
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