Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

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Authors
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric
Conference
14th Electronics Packaging Technology Conference - EPTC
Title
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Publication type
Proceedings paper
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