Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

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Author(s)

Gonzalez, Mario

;

Vandevelde, Bart

;

Ivankovic, Andrej

;

Cherman, Vladimir

;

Debecker, Bjorn

;

Lofrano, Melina

;

De Wolf, Ingrid

;

;

;

;

Metrics

1923 since deposited on 2021-10-20

Acq. date: 2025-10-29