Publication:

Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

Date

2012
Proceedings Paper
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dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T11:15:28Z
dc.date.available2021-10-20T11:15:28Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20735
dc.source.conference14th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate5/12/2012
dc.source.conferencelocationSingapore
dc.title

Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

dc.typeProceedings paper
dspace.entity.typePublication
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