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Conference contributions
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Publication:
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Date
2013
Meeting abstract
Simple item page
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26352.pdf
1.4 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Ivankovic, Andrej
;
Debecker, Bjorn
;
Lofrano, Melina
;
Vanstreels, Kris
;
Cherman, Vladimir
;
Gonzalez, Mario
;
Van der Plas, Geert
;
De Wolf, Ingrid
;
Beyne, Eric
;
Tokei, Zsolt
Journal
Abstract
Description
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Downloads
1
since deposited on 2021-10-21
Acq. date: 2025-10-29
Views
2003
since deposited on 2021-10-21
Acq. date: 2025-10-29
Citations
Metrics
Downloads
1
since deposited on 2021-10-21
Acq. date: 2025-10-29
Views
2003
since deposited on 2021-10-21
Acq. date: 2025-10-29
Citations