Authors

Lofrano, Melina; Gonzalez, Mario; Guo, Wei; Van der Plas, Geert

Conference

16th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE

Title

Chip package interaction: A stress analysis on 3D IC's packages

Publication type

Proceedings paper

Embargo date

9999-12-31