Publication:

Chip package interaction: A stress analysis on 3D IC's packages

Date

2015

Proceedings Paper

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Files

30842.pdf 2.2 MB

Author(s)

Lofrano, Melina

;

Gonzalez, Mario

;

;

Van der Plas, Geert

Statistics

1889 since deposited on 2021-10-22

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Acq. date: 2026-02-27