dc.contributor.author | Ding, Youqi | |
dc.contributor.author | Lofrano, Melina | |
dc.contributor.author | Varela Pedreira, Olalla | |
dc.contributor.author | Zahedmanesh, Houman | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2023-03-02T13:40:29Z | |
dc.date.available | 2022-12-30T03:10:10Z | |
dc.date.available | 2023-03-02T13:40:29Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.other | WOS:000896862600013 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40920.2 | |
dc.source | WOS | |
dc.title | A combined modelling approach to design test structures to study thermomigration in Cu interconnects | |
dc.type | Journal article | |
dc.contributor.imecauthor | Ding, Youqi | |
dc.contributor.imecauthor | Lofrano, Melina | |
dc.contributor.imecauthor | Varela Pedreira, Olalla | |
dc.contributor.imecauthor | Zahedmanesh, Houman | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Varela Pedreira, Olalla::0000-0002-2987-1972 | |
dc.contributor.orcidimec | Zahedmanesh, Houman::0000-0002-0290-691X | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.identifier.doi | 10.1016/j.microrel.2022.114632 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 114632 | |
dc.source.endpage | na | |
dc.source.journal | MICROELECTRONICS RELIABILITY | |
dc.source.issue | na | |
dc.source.volume | 138 | |
imec.availability | Published - imec | |