Browsing by author "Croes, Kristof"
Now showing items 1-20 of 282
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1/f noise measurements for faster electromigration characterization
Beyne, Sofie; Croes, Kristof; De Wolf, Ingrid; Tokei, Zsolt (2016) -
1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections
Beyne, Sofie; Croes, Kristof; De Wolf, Ingrid; Tokei, Zsolt (2016) -
1Xnm copper and low-k reliability
Tokei, Zsolt; Croes, Kristof (2011-09) -
21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
3D IC interconnects: microbump yield electrical characterization and TSV modeling
Vakoula, Panagiota; Tyrovouzi, Anna-Maria; Velenis, Dimitrios; Stucchi, Michele; Croes, Kristof (2014) -
A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
Lofrano, Melina; Wilson, Chris; Croes, Kristof (2012) -
A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Ding, Youqi; Lofrano, Melina; Varela Pedreira, Olalla; Zahedmanesh, Houman; Croes, Kristof; De Wolf, Ingrid (2022) -
A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Saleh, Ahmed; Croes, Kristof; Ceric, H.; De Wolf, Ingrid; Zahedmanesh, Houman (2023) -
A NEMS based sensor to monitor stress in deep sub-micron Cu/Low-$k$ interconnects
Wilson, Chris; Croes, Kristof; Van Cauwenberghe, Marc; Tokei, Zsolt; Beyer, Gerald; Horsfall, Alton; O'Neill, Anthony (2009) -
A novel electromigration characterization method based on low-frequency noise measurements
Beyne, Sofie; Varela Pedreira, Olalla; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2019) -
A Novel System-Level Physics-based Electromigration Modelling Framework: Application to the Power Delivery Network
Zahedmanesh, Houman; Ciofi, Ivan; Zografos, Odysseas; Badaroglu, Mustafa; Croes, Kristof (2021) -
A novel test structure to study intrinsic reliability of barrier/low-k
Zhao, Larry; Tokei, Zsolt; Gianni, Giai Gischia; Pantouvaki, Marianna; Croes, Kristof; Beyer, Gerald (2009) -
A pragmatic network-aware paradigm for system-level electromigration predictions at scale
Zahedmanesh, Houman; Roussel, Philippe; Ciofi, Ivan; Croes, Kristof (2023) -
A tool flow for predicting system level timing failures due to interconnect reliability degradation
Guo, Jin; Papanikolaou, Antonis; Stucchi, Michele; Croes, Kristof; Tokei, Zsolt; Catthoor, Francky (2008) -
Accelerated device degradation analysis on high speed Ge waveguide photodetectors
Lesniewska, Alicja; Srinivasan, Ashwyn; Van Campenhout, Joris; O'Sullivan, Barry; Croes, Kristof (2019) -
Advanced metallization scheme for 3×50μm via middle TSV and beyond
Van Huylenbroeck, Stefaan; Li, Yunlong; Heylen, Nancy; Croes, Kristof; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Gopinath, Sanjay; Nalla, Praveen; Thorum, Matthew; Meshram, Prashant; Anjos, Daniela M.; Yu, Jengyi (2015) -
Advanced physical analysis of 3D interconnect
Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012) -
Airgaps in advanced nano-interconnects; mechanics and impact on electromigration
Zahedmanesh, Houman; Besser, Paul; Wilson, Chris; Croes, Kristof (2016) -
Alternative metals for advanced interconnects
Adelmann, Christoph; Wen, Liang Gong; Peter, Antony; Siew, Yong Kong; Dutta, Shibesh; Croes, Kristof; Swerts, Johan; Popovici, Mihaela Ioana; Sankaran, Kiroubanand; Pourtois, Geoffrey; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2014-10) -
Alternative metals for advanced interconnects
Adelmann, Christoph; Wen, Liang Gong; Peter, Antony; Siew, Yong Kong; Croes, Kristof; Swerts, Johan; Popovici, Mihaela Ioana; Sankaran, Kiroubanand; Pourtois, Geoffrey; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2014)