Browsing by author "Croes, Kristof"
Now showing items 21-40 of 277
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Analysis and characterization of a mechanical sensor to monitor stress in interconnect features
Wilson, Chris; Croes, Kristof; Tokei, Zsolt; Beyer, Gerald; Gallacher, Barry; Bull, Steve; Horsfall, Alton; O'Neill, Anthony (2010) -
Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
Ceric, Hajdin; Zahedmanesh, Houman; Croes, Kristof (2019) -
Analyzing the Electromigration Challenges of Computation in Resistive Memories
Mayahinia, Mahta; Tahoori, Mehdi; Perumkunnil, Manu; Croes, Kristof; Catthoor, Francky (2022) -
Anomalous C-V inversion in TSV's: The problem and its cure
Stucchi, Michele; De Vos, Joeri; Jourdain, Anne; Li, Yunlong; Van der Plas, Geert; Croes, Kristof; Beyne, Eric (2018) -
Application of a nano-mechanical sensor to monitor stress in copper damascene interconnects
Wilson, Chris; Croes, Kristof; Tokei, Zsolt; Vereecke, Bart; Beyer, Gerald; O'Neill, A.G.; Horsfall, A.B. (2009) -
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Tang, Baojun; Croes, Kristof; Barbarin, Yohan; Wang, Yunqi; Degraeve, Robin; Li, Yunlong; Toledano Luque, Maria; Kauerauf, Thomas; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid (2014) -
Assessment of critical Co electromigration parameters
Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Roussel, Philippe; van der Veen, Marleen; Simons, Veerle; Chery, Emmanuel; Ciofi, Ivan; Croes, Kristof (2022) -
Assessment of Electromigration in Nano-Interconnects
Ceric, Hajdin; Selberherr, Siegfried; Zahedmanesh, Houman; de Orio, Roberto; Croes, Kristof (2019) -
Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper
Wen, Liang Gong; Roussel, Philippe; Varela Pedreira, Olalla; Briggs, Basoene; Groven, Benjamin; Dutta, Shibesh; Popovici, Mihaela Ioana; Heylen, Nancy; Ciofi, Ivan; Vanstreels, Kris; Osterberg, Frederik; Hansen, Ole; Petersen, Dirch H.; Opsomer, Karl; Detavernie, Christophe; Wilson, Chris; Van Elshocht, Sven; Croes, Kristof; Bommels, Jurgen; Tokei, Zsolt; Adelmann, Christoph (2016-09) -
Barrier/liner stacks for scaling the Cu interconnect metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Calibrated Modeling of Line-to-Line Dielectric Reliability: LER Specs to Meet Reliability Constraints at Operating Conditions
Ciofi, Ivan; Roussel, Philippe; Saad, Yves; Melvin, Lawrence; Wilson, Chris; Croes, Kristof (2019) -
Challenges for Interconnect Reliability: From Element to System Level
Varela Pedreira, Olalla; Zahedmanesh, Houman; Ding, Youqi; Ciofi, Ivan; Croes, Kristof (2023) -
Cobalt and Ruthenium drift in ultra-thin oxides
Tierno, Davide; Varela Pedreira, Olalla; Wu, Chen; Jourdan, Nicolas; Kljucar, Luka; Tokei, Zsolt; Croes, Kristof (2019) -
Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
van der Veen, Marleen; Vandersmissen, Kevin; Dictus, Dries; Demuynck, Steven; Liu, Ran; Bin, Xiaomin; Nalla, Praveen; Lesniewska, Alicja; Hall, Laurie; Croes, Kristof; Zhao, Larry; Boemmels, Juergen; Kolics, Artur; Tokei, Zsolt (2015) -
Comparison between intrinsic and integrated reliability properties of low-k materials
Croes, Kristof; Pantouvaki, Marianna; Carbonell, Laure; Zhao, Larry; Beyer, Gerald; Tokei, Zsolt (2011) -
Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
Wilson, Chris; De Wolf, Ingrid; Vandevelde, Bart; De Messemaeker, Joke; Ablett, James M.; Redolfi, Augusto; Simons, Veerle; Beyne, Eric; Croes, Kristof (2012) -
Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects
Wu, C.; Vaisman Chasin, Adrian; Demuynck, Steven; Horiguchi, Naoto; Croes, Kristof (2020) -
Considering percolation path growth in low-k dielectric TDDB measurements
Wu, Chen; Li, Yunlong; Tokei, Zsolt; Croes, Kristof (2017) -
Constant voltage electromigration for advanced BEOL copper interconnects
Tang, Baojun; Croes, Kristof; Jourdain, Anne; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid; Wilcox, Eric; McMullen, Timothy (2015)