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Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
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Authors
Vakanas, George
;
Vandecasteele, Bjorn
;
De Preter, Inge
;
Derakhshandeh, Jaber
;
Snyder, Brad
;
Van Campenhout, Joris
;
Croes, Kristof
;
Rebibis, Kenneth June
;
Beyne, Eric
Conference
23rd Conference on Materials for Advanced Metallization - MAM
Title
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Publication type
Meeting abstract
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