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Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications

Date

2014
Meeting abstract
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dc.contributor.authorVakanas, George
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorSnyder, Brad
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorCroes, Kristof
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T06:53:54Z
dc.date.available2021-10-22T06:53:54Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24655
dc.source.conference23rd Conference on Materials for Advanced Metallization - MAM
dc.source.conferencedate2/03/2013
dc.source.conferencelocationChemnitz Germany
dc.title

Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications

dc.typeMeeting abstract
dspace.entity.typePublication
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