Authors

van der Veen, Marleen; Vandersmissen, Kevin; Dictus, Dries; Demuynck, Steven; Liu, Ran; Bin, Xiaomin; Nalla, Praveen; Lesniewska, Alicja; Hall, Laurie; Croes, Kristof; Zhao, Larry; Boemmels, Juergen; Kolics, Artur; Tokei, Zsolt

Conference

IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM

Title

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

Publication type

Proceedings paper

Embargo date

9999-12-31